Samsung Electronics reportedly secured approval from Nvidia for its latest high-bandwidth memory (HBM), 18 months after the Korean vendor started sampling its 12-layer chip to customers.

The upgraded HBM chip received its long-awaited qualification after a redesign to address heat issues, The Korea Economic Daily reported, which noted initial supply volumes were expected to be limited.

Nvidia will use the chip in its B300 AI accelerator.

Rivals SK Hynix and Micron Technology gained approval from Nvidia earlier.

Samsung began shipping its HBM3E to US-based AMD in June.

When it first developed the HBM3E in February 2024, Samsung forecast mass production to start in the first half of 2024. In March it placed orders for a new type of advanced chipmaking machinery, targeting increasing the production yield of its HBM chips.

Over the past couple of years, Samsung has faced rising competition from local rival SK Hynix and concerns over its fundamental technological competitiveness.

Last October Samsung’s new head of memory business Jun Young-hyun vowed to reorganise the division, with a focus on culture and processes.

Radio Free Mobile founder Richard Windsor wrote earlier in the year he is confident Samsung will return to form with its HBM3E, with Nvidia likely to approve the vendor as a supplier this year.